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Prof. Andrew Sarangan

Nano-Fab Lab: Semiconductor Device Fabrication
+1 937-229-3190
sarangan@udayton.edu
University of Dayton
  • Thin Films
    • RF/DC Sputter
    • E-beam Evaporator
    • PECVD
  • Etching
    • ICP/RIE
    • RIE/O2
    • Wet Etch
  • Lithography
    • Contact Mask Aligner
    • DUV Laser Lithography
    • Spin Coater
    • Spray Developer
    • Photochemicals
  • Substrate Prep
    • Vapor Prime/Image Reversal
    • Megasonic Cleaner
    • UV Ozone
  • Thermal
    • Rapid Thermal
    • Diffusion/Oxidation Furnace
    • Contact Bake
    • Convection Oven
    • RT Hotplates
    • Muffle Furnace
  • Packaging
    • Wafer Bonder
    • Wire Bonder
    • Thinning/Polishing
    • Microfluidics
  • Metrology
    • Surface Profiler
    • Atomic Force Microscope
    • SEM Library
    • Reflection/Transmission
    • Compound Microscope
    • Horizontal Microscope
    • Probe Station
    • 4-Point Probe
    • IR Spectroscopy
  • Chemicals
    • Photoresists
    • Developers
    • Ancillary Photochemicals
    • Solvents
    • Acids
    • Wet Etchants
    • Gases
    • Solids
    • Sputter Targets
    • Other Chemicals
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  • Projects
    • Laser Interference Lithography
    • Silicon Nanowires (MACE)
    • Optical Waveguide Sensors
    • Nanostructured Thin Films
    • Metal-Dielectric Thin Films
    • Fourier Multispectral Filters
    • Phase Change Materials (VO2)
    • Phase Change Materials (GST)
    • Silicon Infrared Photodetectors
    • Laser Assisted Chemical Etching (LASE)
    • Computational Electromagnetics
    • Nano-Fab Education
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The sputter deposition system contains three magnetron cathodes which can be configured for RF or DC excitation. The process gases are: argon, oxygen and nitrogen.
+1 937-229-3190
sarangan@udayton.edu
University of Dayton
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